Some researchers have predicted the reliability of solder joints by establishing corresponding models. Thambi et al. [18] built the corresponding fatigue models using standalone fatigue evaluation software and discussed the correction factors. Ding et al. [19] found that the crack paths changed from intergranular to transgranular with an increase in the loading rate. Chang et al. [20] investigated the fracture path at the interface of SnZn9Cu5Zn8 and within the SnZn9Ag0.5 solder alloy. Lai et al. [21] analyzed the crack initiation and propagation during the fracture of SnBi25 and SnBi35 solders using finite element analysis. Ye et al. [22] reported that the bend fracture energy of SnBi58 depends on the loading speed. When the joints had a high solder alloy hardness and thick IMC layer, fracture occurred in the solder alloy [23]. Li et al. [24] found that the fracture mechanism was a mixed mode, i.e., a combination of brittle and ductile fracture rather than ductile fracture alone. With an increase in the addition of Sb and isothermal storage time, Lee et al. [25] found that fracture occurred in the IMCs, but not in the solder mode or mixed mode. It was also reported that an increase in the reflow temperature increased the elastic energy release and shear strength of solder joints [26].
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